The electrochemical deposition (ECD) equipment market for IC packaging is heating up as 2.5D, 3D and fan-out technologies begin to ramp. Applied Materials recently rolled out an ECD system for IC ...

Improvements in the deposition of copper will usher in new ultralarge-scale ICs. Copper has become the material of choice for fabricating connections on ultralarge scale integrated circuits. The ...

An international research group has achieved a 22.1% power conversion efficiency in a bifacial heterojunction crystalline solar cell fabricated through copper (Cu) plating metallization. “We developed ...

Cyclic voltammetric stripping (CVS) analysis can be used to facilitate the detection of mercaptopropylsulfonic acid (MPS). MPS is the breakdown product of bis ...

San Jose, California – October 20, 2009 – Novellus Systems (NASDAQ: NVLS) today introduced the SABRE Excel, an advanced copper electroplating system designed to provide industry-leading fill and ...

Electroplating intermediates refer to a class of fine chemicals used as electroplating additives. Unlike the salt used in the plating production process, the electroplating intermediate is an additive ...