US storage and inverter specialist Yotta Energy says its new package has several advantages compared to conventional C&I solar storage solutions. For example, the design cuts out the need for a ...

Tanja Braun, group manager at Fraunhofer Institute for Reliability and Microintegration (IZM), sat down with Semiconductor Engineering to talk about III-V device packaging, chiplets, fan-out and panel ...

Several packaging houses are inching closer to production of panel-level fan-out packaging, a next-generation technology that promises to reduce the cost of today’s fan-out packages. In fact, ASE, ...

The AI chip market holds tremendous potential - breakthroughs in FOPLP technology to overcome the RDL-first process barrier will be the key to success. Abstract DIGITIMES observes that fan-out ...

Rapidus, which positions itself as a vertically integrated chipmaker that offers both front-end semiconductor production and back-end packaging, plans to discuss its efforts in the field of ...

Panel maker Innolux is looking to venture into the IC packaging segment by converting its 3.5G LCD panel fab into an advanced packaging plant dedicated to FOPLP (fan-out panel level package) process, ...