SANTA CLARA, Calif.--(BUSINESS WIRE)--OMNIVISION, a leading global developer of semiconductor solutions, including advanced digital imaging, analog, and touch & display technology, today announced the ...
Avago Technologies has introduced a one-quarter inch optical format, 1.3 megapixel CMOS image sensor featuring the company's enhanced-performance (EP) pixel architecture and image-pipe processing ...
Teledyne FLIR OEM introduces the Lepton XDS, a compact dual thermal-visible camera module featuring MSX technology and Prism ISP.
Samsung Electronics has announced the ISOCELL HP3 image sensor, an advanced camera solution for next-generation flagship smartphones. The sensor provides a resolution of 200MP. Also, the 1/1.4-inch ...
Apple in 2025 will take on a new compact camera module (CCM) supplier for future MacBook models powered by its next-generation M5 chip, according to Apple analyst Ming-Chi Kuo. Writing in his latest ...
Alongside the company’s Camera Module 3, it’s also releasing a new module for use with M12-mount lenses. Alongside the company’s Camera Module 3, it’s also releasing a new module for use with ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results