The field of fluid dispensing and microelectronics packaging is at the forefront of technological innovation, merging precise fluid delivery systems with the intricate assembly of semiconductor ...

Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to enable faster designing ...

In pursuit of more powerful microelectronic systems, more powerful microchips must be packaged closer together, with more robust connections – the same is true for the research partnership to achieve ...

ANDOVER, Mass., April 21, 2022 (GLOBE NEWSWIRE) -- Mercury Systems, Inc. (NASDAQ: MRCY, www.mrcy.com), a leader in trusted, secure mission-critical technologies for aerospace and defense, hosted a ...

Microelectronics has been a hot topic in technology circles in recent years. Although the CHIPS and Science Act is a main driver of the latest resurgence, the defense industrial base’s reliance on ...

Plymouth, WI — February 2026 — Kurtz Ersa Inc. is strengthening its position in microelectronics and semiconductor technology. Effective September 1, 2025, ATV Technologie GmbH officially became part ...

The U.S. Department of Defense (DoD) celebrated a milestone achievement for the State-of-the-Art (SOTA) Heterogeneous Integrated Packaging (SHIP) Program with the delivery of the first SHIP prototype ...

DURHAM, N.C.--(BUSINESS WIRE)--Semiconductor Research Corporation (SRC), a world-renowned semiconductor research and workforce development consortium, released an interim report for the ...

The microelectronics-packaging industry is undergoing major changes to keep pace with the relentless demands imposed by high-performing chips and end-use system applications. Solutions using advanced ...

DURHAM, N.C.--(BUSINESS WIRE)--Semiconductor Research Corporation (SRC), a world-renowned high technology research consortium, announced today that it has been selected by the U.S. Department of ...